Archive - Nomad Semi

Deep Dive on HBM

HBM Decoded: Bonding Technologies, Hynix's Leadership and China’s Threat

Jun 3, 2025 • Moore Morris and Ray Wang

Deep Dive on Memory (Primer)

70 Years History, Competitive landscape, 4F2, 3D DRAM

Sep 30, 2025 • Moore Morris

BYD Semiconductor Deep Dive

Unpacking the bear thesis on power semis and TSMC’s footnote in the story

Apr 16, 2025 • Moore Morris

State of the Semiconductor Cycle

Dark cloud is looming

Apr 21, 2025 • Moore Morris

Inside Xiaomi’s Silicon Empire

A 10 Year Journey in Chipmaking: From Surge to XRing

May 22, 2025 • Moore Morris

TSMC 2025 Technology Symposium

A look at semiconductor long-term demand and TSMC's technology roadmap

May 2, 2025 • Moore Morris

MediaTek Deep Dive

Underrated Asian Fabless in Partnership with NVIDIA to Take on the Future of AI, Auto and PC

May 14, 2025 • Moore Morris

TSMC's CoWoS capacity

Why it matters once again

Sep 29, 2024 • Moore Morris

Tokyo Electron Deep Dive - Part 2

Share Gainer in Cryogenic Etching and Bonder

Mar 27, 2025 • Moore Morris

Tokyo Electron Deep Dive - Part 1

Tokyo Electron will defend its 90% coater / developer market share

Mar 15, 2025 • Moore Morris

Intel Foundry Direct Connect 2025

Intel's foundry endeavor is starting to fall in place. A comparison with TSMC

May 8, 2025 • Moore Morris

What SiCarrier’s President Said at SEMICON China

Full transcript below. Find out more about who SiCarrier is

Mar 31, 2025 • Moore Morris

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